Thermal Design by CogniCAD
ParaMatters offers the first Generative Design for thermal loading conditions
Ideal for Heat Sinks and Heat Exchanger
The Heat Conduction Topology Optimization by CogniCAD allows designs of passive cooling devices and heat sinks.
The boundary conditions is temperature applied on faces of non-design regions. Thermal loads are heat flux applied on faces and volumetric heat applied on volume bodies (mimicking conduction and convection). The design objective is to design for thermal compliance under volume fraction constraint. The output of the optimization is a watertight STL and ready for AM.
High complexity heat sink
In minutes the user can set up the load cases.
GE Bracket as heat sink
We are pushing the boundaries.
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