DEMI 800™

Cleaning solutions for PolyJet materials for the removal of support material and resin.

Cleaning solutions for FDM materials for the removal of support material and resin.

Cleaning solutions for FDM materials for the removal of support material and resin.

Cleaning solutions for MIMAKI and FDM materials for the removal of support material and resin.

The PostProcess 403 chemistry is a new formulation that improves upon the performance of the previously released PLM-402-SUB (referred to as 402 from here on). The primary benefits of the solution are the same as those identified previously with the 402 detergent, including industry-leading cycle times and reduction of required process steps. Unlike previous methods which may have required both TPM and dirty IPA baths followed by various rinse steps, cycle times with 403 in PostProcess’s patented hardware technology are frequently less than 10 minutes. Additionally, the process takes place within just one piece of equipment. This effectively cuts down on both attended and unattended process time.

Cleaning solutions for resin materials for the removal of support material and resin.

Cleaning solutions for Carbon Resin materials for the removal of support material and resin.

The proprietary formulation of PLM-601-SUB detergent was developed specifically to solve wax support removal concerns. PostProcess’s new solution has a flashpoint of 204.8°F (96°C) with low volatility and 2-3 times the longevity of other solvents. Large batches of small 3D printed parts can be processed in the DEMI family of solutions with software-controlled parameters, making the process safe and easy for operators. Full batches can be processed in approximately 30 minutes, significantly reducing the technician time typically required to remove wax from parts.