DEMI 4000™

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Industrial resin removal

Looking for a scalable solution for post-processing large volumes of Stereolithography (SLA) prints? The DEMI 4000™ Series is the world's first automated technology specifically designed for resin removal of SLA parts.

Marc-Oliver Heißler Account Manager

The PostProcess™ DEMI 4000™ Series utilizes patented Submersed Vortex Cavitation technology for unprecedented post-processing efficiency, combining software, hardware and chemical components for optimal resin removal.

The PostProcess™ DEMI 4000™ Series provides precise control over temperature and ultrasonically generated cavitations, allowing for reduced process times.

Technical specifications:

Pool size: 890 x 890 x 635 mm

Capacity for consumables: 984 liters

Lifting capacity: 90kg


Automated submersion

The PostProcess™ DEMI 4000™ features an automatic lifting system in a fully enclosed enclosure.

It offers an improved user experience while enabling a cleaner and safer work environment. The process area of ​​the DEMI 4000 is compatible with many of the most well-known professional SLA 3D printers, such as B. the ProX 800 from 3D Systems, the NEO800 and the V650 from Stratasys.

Vortex Pumping System

PostProcess® SVC solutions use a sophisticated pumping system to rotate the part while it is immersed in the cleaning agent.

The Vortex component of SVC technology guarantees that the part is evenly exposed to the detergent and cavitation of the ultrasound, regardless of density or geometry and their impact on the buoyancy of the part.

Variable ultrasound

PostProcess® uses ultrasonically generated cavitation as an additional source of mechanical energy to improve chemistry. The ultrasound creates compression and expansion waves in the cleaning agent by emitting sound waves with different frequencies and amplitudes.

At the surface of the part, the movement of the liquid causes cavitation and the formation of small bubbles. As the chemical weakens the carrier material, these bubbles stir it up, accelerating the reaction.

Optimal wave generation

With a conventional system, the carrier material dissolves and falls to the bottom of the machine. The efficiency of the wave produced by the transducer would then be affected by this deposited material.

PostProcess® SVC machines have reduced this problem and ensure optimal efficiency throughout the cycle.

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The PostProcess® DEMI 4000™ is capable of significantly increasing throughput. It makes the use of multiple machines obsolete and allows the user to use multiple build platforms ergonomically and at the same height.

Advanced cleaning agents

The unique chemistry of PostProcess® is a key factor in the effectiveness of SVC technology.

The three main cleaning agents in the SVC line have all been developed by PhD chemists specifically for the cleaning of additive materials.

Each printing process has its own special cleaning agents, which have been optimized for the materials used.

PostProcess® cleaning solutions dissolve the substrate or uncured resin without damaging the build material.

Software-controlled cleaning algorithm

The flushing algorithm, which carefully controls the energy, speed and direction of the system, ensures that cleaning time is minimized.

The AUTOMAT3D® software varies the rinsing intensity, the temperature and the process time in order to achieve ideal cleaning in the shortest possible time.

Data Sheet PostProcess® DEMI 4000™

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